Casela Technologies Demonstrates High Power External Laser Source Module Supporting the OIF-ELSFP Implementation Agreement at OFC 2023 | News Direct

Casela Technologies Demonstrates High Power External Laser Source Module Supporting the OIF-ELSFP Implementation Agreement at OFC 2023

Casela Technologies
News release by Casela Technologies

facebook icon linkedin icon twitter icon pinterest icon email icon Palo Alto, CA | March 03, 2023 09:11 AM Eastern Standard Time

March 3, 2023, Palo Alto, CA Casela Technologies announces the introduction of its multi-fiber external laser source (ELS) modules operating at 1310nm and CWDM4 wavelengths. The module uses blind mate optical and electrical connectors supporting OIF’s (Optical Internetworking Forum’s) external laser small form factor pluggable (ELSFP) implementation agreement.

The module will be “live” at the OIF Co-Packaging (CPO) Interoperability Demonstration (booth #5101) at OFC (the Optical Fiber Conference) next week, March 5-9, 2023, in San Diego, CA. In addition, Casela is providing the light source for OIF’s joint CEI and co-packaging demo, whereby a linearly driven optical module is powered optically by an ELSFP through polarization-maintaining fiber. Casela’s ELSFP is part of the Front panel I/O, and ELSFP Connectivity Options demo to show multi-vendor compatibility.

These uncooled ELSFP modules deliver greater than 100mW into each of 8 polarization-maintaining fibers to power up integrated, high data capacity silicon photonics systems such as CPO and SOC-based AI accelerators. The modules use Casela’s recently announced 200mW uncooled DFB lasers that operate with >20% power conversion efficiency up to 70 oC module temperature. These high-power, high-efficiency lasers eliminate the need for a thermoelectric cooler (TEC), delivering best-in-class low-power consumption for an external laser source. Modules can be specified with 2 x DR4, 2 x FR4 or other WDM wavelength combinations. These lasers are available for sampling now, with production commencing in Q4 2023.

Casela Technologies is a global, vertically integrated semiconductor laser company delivering high-performance laser technology, products and platforms to data communication infrastructure and sensing markets. Working with OIF, Casela plans to help accelerate the adoption of high optical power, high lane count and high-speed connectivity in fully integrated modules.

OIF Hosts Largest Ever Multi-Vendor Interoperability Demonstration of the Critical Solutions Accelerating Implementation of Next-Generation Capabilities at OFC 2023; Celebrates 25 Years of Interoperability Work

OIF will host its largest ever demonstration of multi-vendor interoperability at this year’s OFC 2023, March 7-9 in San Diego, CA, featuring four fundamental technology areas - 400ZR optics; Co-Packaging architectures; Common Electrical I/O (CEI) channels; and Common Management Interface Specification (CMIS) implementations. The demos will be both live and static at OIF’s booth, #5101. Additional information can be found at https://www.oiforum.com/meetings-events/oif-ofc-2023/

   

 

About Casela Technologies

Casela is developing a broad range of lasers, including CW lasers, electroabsorption-modulated lasers (EMLs), and external lasers modules using a proven and reliable buried heterostructure laser platform. For more information, visit w w w.caselatech.com 

 

Contact Details

 

Wilkinson + Associates for Casela

 

Leah Wilkinson

 

+1 703-907-0010

 

leah@wilkinson.associates

project media

Tags

ELSPlasersOIFexternal laser sourceOFC 2023semiconductor